BCR153...
PNP Silicon Digital Transistor
• Switching circuit, inverter, interface circuit,
driver circuit
• Built in resistor (R1=2.2kΩ, R 2=2.2kΩ)
• BCR153U: Two internally isolated
transistors with good matching
in one multichip package
BCR153F/L3
BCR153T
C
3
R1
R2
1
B
2
E
EHA07183
Type
Marking
Pin Configuration
Package
BCR153F
WBs
1=B
2=E
3=C
-
-
-
TSFP-3
BCR153L3
WB
1=B
2=E
3=C
-
-
-
TSLP-3-4
BCR153T
WB
1=B
2=E
3=C
-
-
-
SC75
Maximum Ratings
Parameter
Symbol
Collector-emitter voltage
VCEO
50
Collector-base voltage
VCBO
50
Input forward voltage
Vi(fwd)
20
Input reverse voltage
Vi(rev)
10
Collector current
IC
100
Total power dissipation
Ptot
Value
250
BCR153L3, TS ≤ 135°C
250
BCR153T, TS ≤ 109°C
250
Tj
Storage temperature
Tstg
1
V
mA
mW
BCR153F, TS ≤ 128°C
Junction temperature
Unit
150
°C
-65 ... 150
2006-05-10
BCR153...
Thermal Resistance
Parameter
Junction - soldering point1)
Symbol
RthJS
Value
BCR153F
≤ 90
BCR153L3
≤ 60
BCR153T
≤ 165
Unit
K/W
Electrical Characteristics at TA = 25°C, unless otherwise specified
Symbol
Values
Unit
Parameter
min.
typ. max.
DC Characteristics
Collector-emitter breakdown voltage
V(BR)CEO 50
V
IC = 100 µA, IB = 0
Collector-base breakdown voltage
50
-
-
I CBO
-
-
100
nA
I EBO
-
-
3.5
mA
h FE
20
-
-
-
-
-
0.3
V
Vi(off)
0.8
-
1.5
Vi(on)
0.8
-
2.5
Input resistor
R1
1.5
2.2
2.9
kΩ
Resistor ratio
R1/R 2
0.9
1
1.1
-
fT
-
200
-
MHz
Ccb
-
3
-
pF
V(BR)CBO
IC = 10 µA, IE = 0
Collector-base cutoff current
VCB = 40 V, IE = 0
Emitter-base cutoff current
VEB = 10 V, IC = 0
DC current gain2)
IC = 20 mA, VCE = 5 V
Collector-emitter saturation voltage2)
VCEsat
IC = 20 mA, IB = 1 mA
Input off voltage
IC = 100 µA, VCE = 5 V
Input on voltage
IC = 2 mA, VCE = 0.3 V
AC Characteristics
Transition frequency
IC = 10 mA, VCE = 5 V, f = 100 MHz
Collector-base capacitance
VCB = 10 V, f = 1 MHz
1For calculation of R
thJA please refer to Application Note Thermal Resistance
2Pulse test: t < 300µs; D < 2%
2
2006-05-10
BCR153...
DC current gain hFE = ƒ(IC)
VCE = 5V (common emitter configuration)
Collector-emitter saturation voltage
VCEsat = ƒ(IC), hFE = 20
10 3
10 2
A
IC
h FE
10 2
10 1
10 1
10 0
10 -1 -4
10
10
-3
10
-2
A
10
10 0
0
-1
V
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8
IC
1
VCEsat
Input on Voltage Vi(on) = ƒ(IC )
VCE = 0.3V (common emitter configuration)
Input off voltage V i(off) = ƒ(IC)
VCE = 5V (common emitter configuration)
10 -2
10 -1
A
A
10 -3
IC
IC
10 -2
10 -4
10 -3
10 -5
10 -4 -1
10
10
0
10
1
V
10
10 -6
0.6
2
Vi(on)
0.8
1
1.2
1.4
V
1.7
Vi(off)
3
2006-05-10
BCR153...
Total power dissipation Ptot = ƒ(TS)
BCR153F
Total power dissipation Ptot = ƒ(TS)
BCR153L3
300
300
mW
250
250
225
225
200
200
P tot
P tot
mW
175
175
150
150
125
125
100
100
75
75
50
50
25
25
0
0
15
30
45
60
75
90 105 120 °C
0
0
150
TS
15
30
45
60
75
90 105 120 °C
150
TS
Total power dissipation Ptot = ƒ(TS)
BCR153T
300
mW
250
Ptot
225
200
175
150
125
100
75
50
25
0
0
15
30
45
60
75
90 105 120 °C
150
TS
4
2006-05-10
BCR153...
Permissible Puls Load RthJS = ƒ (tp)
Permissible Pulse Load
BCR153F
Ptotmax/P totDC = ƒ(tp)
BCR153F
10 2
10 3
D=0.5
0.2
0.1
0.05
0.02
0.01
0.005
0
10 1
10 0
10 -1 -6
10
P totmax/P totDC
RthJS
K/W
10
-5
10
-4
10
-3
10 2
D=0
0.005
0.01
0.02
0.05
0.1
0.2
0.5
10 1
10
-2
s
10
10 0 -6
10
0
10
-5
10
-4
10
-3
10
-2
s
tp
Permissible Pulse Load
BCR153L3
Ptotmax/P totDC = ƒ(tp)
BCR153L3
10
0
10 3
Ptotmax/ PtotDC
RthJS
10 2
1
0.5
0.2
0.1
0.05
0.02
0.01
0.005
D=0
10 0
10 -1 -7
10
0
tp
Permissible Puls Load RthJS = ƒ (tp)
10
10
10
-6
10
-5
10
-4
10
-3
10
-2
10
D=0
0.005
0.01
0.02
0.05
0.1
0.2
0.5
2
10 1
s
10
10 0 -7
10
0
tp
10
-6
10
-5
10
-4
10
-3
10
-2
s
tp
5
2006-05-10
BCR153...
Permissible Puls Load RthJS = ƒ (tp)
Permissible Pulse Load
BCR153T
Ptotmax/P totDC = ƒ(tp)
BCR153T
10 3
10 3
P totmax / P totDC
K/W
RthJS
10 2
D=0
0.005
0.01
0.02
0.05
0.1
0.2
0.5
10 2
10 1
D=0.5
0.2
0.1
0.05
0.02
0.01
0.005
0
10 0
10 -1 -6
10
10
-5
10
-4
10
-3
10 1
10
-2
s
10
10 0 -6
10
0
tp
10
-5
10
-4
10
-3
10
-2
s
10
0
tp
6
2006-05-10
Package SC75
BCR153...
Package Outline
1.6 ±0.2
0.2 +0.1
-0.05
A
0.1 MAX. 0.7 ±0.1
0.2 +0.1
-0.05
2
10˚ MAX.
0.8 ±0.1
1
10˚ MAX.
1.6 ±0.2
3
0.15 ±0.1
0.5
0.10
0.5
0.20
M
M
A
Foot Print
0.65
1.15
0.65
0.4
0.4
0.5 0.5
Marking Layout (Example)
2005, December
Date code
BCR108T
Type code
Pin 1
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø330 mm = 10.000 Pieces/Reel
4
0.2 MAX.
1.8
8
1.4
0.45
Pin 1
1.75
0.9
7
2006-05-10
BCR153...
Date Code marking for discrete packages with
one digit (SCD80, SC79, SC75 1) ) CES-Code
Month 2 0 03
2 0 04
2005
2006
2 0 07
2008
2009
2010
2011
2012
2 0 13
2014
01
a
p
A
P
a
p
A
P
a
p
A
P
02
b
q
B
Q
b
q
B
Q
b
q
B
Q
03
c
r
C
R
c
r
C
R
c
r
C
R
04
d
s
D
S
d
s
D
S
d
s
D
S
05
e
t
E
T
e
t
E
T
e
t
E
T
06
f
u
F
U
f
u
F
U
f
u
F
U
07
g
v
G
V
g
v
G
V
g
v
G
V
08
h
x
H
X
h
x
H
X
h
x
H
X
09
j
y
J
Y
j
y
J
Y
j
y
J
Y
10
k
z
K
Z
k
z
K
Z
k
z
K
Z
11
l
2
L
4
l
2
L
4
l
2
L
4
12
n
3
N
5
n
3
N
5
n
3
N
5
1) New Marking Layout for SC75, implemented at October 2005.
.
8
2006-05-10
Package TSFP-3
BCR153...
Package Outline
0.2 ±0.05
0.55 ±0.04
1
1.2 ±0.05
0.2 ±0.05
3
2
0.2 ±0.05
10˚ MAX.
0.8 ±0.05
1.2 ±0.05
0.15 ±0.05
0.4 ±0.05
0.4 ±0.05
Foot Print
1.05
0.45
0.4
0.4
0.4
Marking Layout (Example)
Manufacturer
BCR847BF
Type code
Pin 1
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø330 mm = 10.000 Pieces/Reel
4
0.2
1.2
1.5
8
0.3
Pin 1
0.7
1.35
9
2006-05-10
Package TSLP-3-4
BCR153...
Package Outline
Bottom view
0.4 +0.1
0.6 ±0.05
0.5 ±0.035 1)
2
3
2
1
0.35 ±0.05
Pin 1
marking
1±0.05
3
2 x 0.25 ±0.035 1)
0.575 ±0.05
0.05 MAX.
1
0.4 ±0.035 1)
Top view
2 x 0.15 ±0.035 1)
1) Dimension applies to plated terminal
Foot Print
0.225
0.225
Solder mask
0.315
R0.1
0.2
0.2
0.17
0.15
Copper
0.5
0.95
0.2
0.35
1
0.45
R0.19
0.255
0.6
0.38
For board assembly information please refer to Infineon website "Packages"
Stencil apertures
Marking Layout
BCR133L3
Type code
Pin 1 marking
Laser marking
Standard Packing
Reel ø180 mm = 15.000 Pieces/Reel
0.5
Pin 1
marking
8
1.16
4
0.76
10
2006-05-10
BCR153...
Edition 2006-02-01
Published by
Infineon Technologies AG
81726 München, Germany
© Infineon Technologies AG 2006.
All Rights Reserved.
Attention please!
The information given in this dokument shall in no event be regarded as a guarantee
of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any
examples or hints given herein, any typical values stated herein and/or any information
regarding the application of the device, Infineon Technologies hereby disclaims any
and all warranties and liabilities of any kind, including without limitation warranties of
non-infringement of intellectual property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices
please contact your nearest Infineon Technologies Office ( www.infineon.com).
Warnings
Due to technical requirements components may contain dangerous substances.
For information on the types in question please contact your nearest
Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or
systems with the express written approval of Infineon Technologies, if a failure of
such components can reasonably be expected to cause the failure of that
life-support device or system, or to affect the safety or effectiveness of that
device or system.
Life support devices or systems are intended to be implanted in the human body,
or to support and/or maintain and sustain and/or protect human life. If they fail,
it is reasonable to assume that the health of the user or other persons
may be endangered.
11
2006-05-10
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